Machine vision for defect detection on silicon wafers
نویسندگان
چکیده
For several real-world problems, the mathematical methods of signal and image processing are most successful when they also incorporate the insight offered by the physics of the problem. Imaging systems are a particularly fertile ground for problems in this class because they deal specifically with the capture of physical scenes and with the reproduction of images on physical devices. Solutions for these problems that combine physical understanding and modeling with appropriate mathematical tools of signal/image processing, offer advantages significantly greater than the sum of the individual parts. In this article, we illustrate how the happy marriage between physical insight and modeling and apTo download the electronic version of this newsletter, please go to: http://spie.org/membership/ei/pdfs/ei15-2.pdf
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